It is widely used in the solar industry to connect solar cells together in a solar module. It is a thin and flexible tin/silver coated ribbon that is placed on the front and back of a solar cell and soldered to create a series connection between the cells.
PV interconnect Flat Ribbon
width(mm) | 0.4 – 2.5 |
Thickness(mm) | 0.1 – 0.35 |
Standard Coating | 16μm – 25μm (single side) |
Available Coating Type
Leaded Coating | Sn60Pb40 | Sn62Pb36Ag2 |
ROHS COMPLIANCED (lead Free) Coating | Sn100 | Sn96.5Bi38Ag2 |
SnAgCu | Sn60Bi38Ag2 |
Technical Parameter
Elongation | ≥ 25% |
Yield Strength | 55 – 70 N/mm² |
Tensile Strength | 150 – 200 N/mm² |
Camber Rate | ≤5mm/1000mm |
Resistivity | ≤2.2 × 10⁻⁸ Ωm@20°C |
Specification of the Base Metal
Copper Grades | Cu-ETP |
Cu-OF |
Resistivity | 1.707 × 10⁻⁸ Ωmm²@20°C |
Density | 8.89 gm/cm³ |
Conductivity(100% min) | 101% |
Packing spool type
HKV-160 (Bioconical) | 10S (Cylindrical) |
The busbar is connected to the perimeter of the solar module.The current generated by the solar panel is carried through an interconnect ribbon and transferred to a junction box via a busbar ribbon.
PV Busbar
width(mm) |
3.00 – 8.00 |
Thickness(mm) |
0.1 – 0.4 |
Standard Coating |
16μm – 25μm (single side) |
Available Coating Type
Leaded Coating |
Sn60Pb40 |
Sn62Pb36Ag2 |
ROHS COMPLIANCED (lead Free) Coating |
Sn100 |
Sn96.5Bi38Ag2 |
SnAgCu |
Sn60Bi38Ag2 |
Technical Parameter
Elongation |
≥ 25% |
Yield Strength |
< 145 N/mm² |
Tensile Strength |
≥ 150 N/mm² |
Camber Rate |
≤ 5mm/1000mm |
Resistivity |
≤ 2.2 × 10⁻⁸ Ωm@20°C |
Specification of the Base Metal
Copper Grades |
Cu-ETP |
Cu-OF |
Resistivity |
≤ 1.707 × 10⁻⁸ Ωmm²@20°C |
Density |
8.89 gm/cm³ |
Conductivity(100% min) |
≥ 101% |
Packing spool type
HKV-160 (Bioconical) |
10S (Cylindrical) |